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All laser direct writing process for temperature sensor based on graphene and silver.

Qi Li1, Ruijie Bai2, Lianbo Guo3

  • 1Shanghai Key Laboratory of Intelligent Sensing and Detection Technology, School of Mechanical and Power Engineering, East China University of Science and Technology, Shanghai, 200237, China.

Frontiers of Optoelectronics
|February 4, 2024
PubMed
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A novel temperature sensing array uses laser-induced graphene (LIG) and silver (LIS) for high sensitivity. This method precisely controls material properties, improving temperature measurement accuracy even with pressure interference.

Area of Science:

  • Materials Science
  • Nanotechnology
  • Sensors

Background:

  • Developing highly sensitive temperature sensors is crucial for various applications.
  • Laser-induced graphene (LIG) and laser-induced silver (LIS) offer promising material properties for sensor fabrication.
  • Existing methods may lack precision in controlling material characteristics and compensating for external stimuli.

Purpose of the Study:

  • To fabricate a highly sensitive temperature sensing array using all-laser direct writing (LDW).
  • To investigate the relationship between laser parameters and LIG properties using finite element analysis (FEA).
  • To develop a method for compensating pressure interference in LIS-LIG based temperature sensing.

Main Methods:

  • Fabrication of LIS electrodes and LIG sensing layers via LDW.
Keywords:
Finite element analysisLaser direct writingLaser induced grapheneLaser induced silverTemperature sensor

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  • Development of an FEA photothermal model with phase transition for parameter optimization.
  • Experimental characterization of LIG and LIS electrical and thermal properties.
  • Introduction of a correction factor to mitigate pressure interference.

    • Main Results:

    • LIG resistivity was tunable (0.031–67.2 Ω·m) with a percentage temperature coefficient of resistance (TCR) of -0.58%/°C.
    • FEA model showed <5% deviation for LIG width and <9% for thickness compared to experiments.
    • LIS layers were ~14 μm thick and insensitive to temperature/pressure.
    • Compensation factor reduced temperature measurement difference from 11.2°C to 2.6°C.

    Conclusions:

    • The LDW method enables precise fabrication of LIS-LIG temperature sensing arrays.
    • FEA modeling effectively guides laser processing parameter selection.
    • The developed compensation strategy significantly enhances temperature measurement accuracy in the presence of pressure.