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Combined Displacement and Angle Sensor with Ultra-High Compactness Based on Self-Imaging Effect of Optical
Mengdi Zhang1, Hao Yang1, Qianqi Niu1
1School of Instrument and Electronics, North University of China, Taiyuan 030051, China.
Sensors (Basel, Switzerland)
|February 10, 2024
Summary
This study introduces a compact optical micrograting sensor for simultaneous linear and angular displacement measurement. The novel sensor achieves high resolution for displacement and sensitive angle detection, paving the way for advanced positioning systems.
Area of Science:
- Optoelectronics
- Nanotechnology
- Metrology
Background:
- Accurate measurement of linear and angular displacement is crucial for precision engineering and manufacturing.
- Existing sensors often lack compactness or the ability for simultaneous multi-dimensional measurements.
- Optical microgratings offer potential for miniaturized sensing solutions.
Purpose of the Study:
- To propose and demonstrate an ultracompact, combined sensor for simultaneous linear and angular displacement measurement.
- To leverage the self-imaging effect of optical microgratings for synchronous sensing.
- To evaluate the sensor's performance in terms of resolution and sensitivity.
Main Methods:
- Utilized a two-grating structure based on the self-imaging effect of optical microgratings.
- Investigated optical transmission properties through theoretical analysis and simulations.
- Experimentally validated the synchronous measurement of linear displacement (phase change) and angular displacement (amplitude change).
Main Results:
- Demonstrated a sinusoidal relationship between optical transmission and linear displacement.
- Observed a decrease in transmission amplitude with increasing pitch angle, enabling angular measurement.
- Achieved a linear displacement resolution of 4 nm and angular sensitivity of 0.26 mV/arcsec within ±1°.
Conclusions:
- The proposed sensor enables ultracompact, synchronous measurement of linear and angular displacement using a single micrograting structure.
- The common-path design, free from additional optical components, enhances compactness and robustness.
- The sensor shows significant potential for applications in integrated mechanical positioning and semiconductor fabrication.
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