Related Experiment Video
Updated: Jul 2, 2025

Tools for Surface Treatment of Silicon Planar Intracortical Microelectrodes
Published on: June 8, 2022
Plasma Surface Treatment of Cu Current Collectors for Improving the Electrochemical Performance of Si Anodes
Jeong-Tae Kim1, Ssendagire Kennedy1, Isheunesu Phiri1
1Department of Chemical and Biological Engineering, Hanbat National University, 125 Dongseo-daero, Yuseong-gu, Daejeon 34158, Republic of Korea.
Abstract:
The practical utilization of Si electrodes is hindered by their substantial volume expansion during alloying and dealloying processes, which causes mechanical damage and separation from Cu current collectors. To alleviate the problem of Si composite detachment from Cu current collectors, the surface of the Cu current collectors is modified using atmospheric oxygen plasma. Plasma treatment improves the wetting ability of the Cu current collectors and, consequently, the coating quality of the Si electrodes. The uniform distribution of the Si electrode components reduces the sheet resistance and improves the adhesion properties of the Si electrodes containing surface-modified Cu current collectors. As a result, the volume expansion of Si during alloying and dealloying is reduced; this results in an excellent rate capability of 1584 mA h g-1 at a current density of 3.6 A g-1 (135% that of bare Cu) and excellent cycle performance of 1545 mA h g-1 after 300 cycles (Si electrodes with bare Cu exhibit 930 mA h g-1). Therefore, the developed plasma treatment method for Cu current collectors is expected to be an economical and efficient approach for improving the Li-ion battery performance.
More Related Videos
07:32Pool-Boiling Heat-Transfer Enhancement on Cylindrical Surfaces with Hybrid Wettable Patterns
Published on: April 10, 2017
08:14Improved Heterojunction Quality in Cu2O-based Solar Cells Through the Optimization of Atmospheric Pressure Spatial Atomic Layer Deposited Zn1-xMgxO
Published on: July 31, 2016