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Integrated optical frequency division for microwave and mmWave generation.

Shuman Sun1, Beichen Wang1, Kaikai Liu2

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|March 6, 2024
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Researchers developed a miniaturized optical frequency division system for ultra-low-noise microwave and millimeter-wave generation. This chip-based technology promises high-performance communication, radar, and sensing systems with potential for mass production.

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Area of Science:

  • Photonics
  • Electrical Engineering
  • Applied Physics

Background:

  • Miniaturized, chip-based generation of ultra-low-noise microwave and millimeter-wave (mmWave) signals is crucial for advancing communication, radar, and sensing technologies.
  • Optical frequency division, utilizing optical references and frequency combs, offers superior spectral purity for microwave generation compared to existing methods.

Purpose of the Study:

  • To demonstrate a miniaturized optical frequency division system suitable for integration onto a complementary metal-oxide-semiconductor (CMOS)-compatible photonic platform.
  • To achieve record-low phase noise for integrated photonic mmWave oscillators.

Main Methods:

  • Employed a large mode volume, planar-waveguide-based optical reference coil cavity for phase stability.
  • Utilized soliton microcombs, generated in a waveguide-coupled microresonator, to divide optical frequencies down to the mmWave range.
  • Explored heterogeneous integration with semiconductor lasers, amplifiers, and photodiodes.

Main Results:

  • Demonstrated a miniaturized optical frequency division system on an integrated photonic platform.
  • Achieved record-low phase noise for integrated photonic mmWave oscillators.
  • Showcased potential for heterogeneous integration, enabling CMOS compatibility.

Conclusions:

  • The developed system can potentially transfer advanced optical frequency division techniques to integrated photonic platforms.
  • The technology holds promise for large-volume, low-cost manufacturing of high-performance mmWave oscillators for diverse applications.
  • This advancement could revolutionize chip-based communication, radar, and sensing systems.