High Aspect Ratio Silver Nanogrids by Bottom-Up Electrochemical Growth as Transparent Electrode

A scalable selective-area electrochemical method is reported for the fabrication of interconnected metal nanostructures. In this work, the fabrication of silver nanowire grids for the application of transparent electrodes is explored. The presented method is based on a through-the-mask electrodeposition method, where the mask is made by using substrate conformal imprint lithography. We find that the nucleation density of the silver nanoparticles is the key parameter for successful homogeneous void-free filling of the template. We independently controlled the density of the silver nuclei and their growth by using a double potential pulse. The silver nanowire grids show high transmission (95.9%) and low sheet resistance (as low as 3.7 Ω/sq), resulting in a superior figure of merit (FoM). Due to the bottom-up nature of this technique, arbitrarily high aspect ratio nanowires can be achieved, therefore decreasing the sheet resistance without affecting transmittance and carrier collection. The presented method can be generalized to the large-area nanofabrication of any well-defined nanostructure design of any metal transparent electrode for multiple applications.