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Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing.

Tomás Pinheiro1, Maria Morais1, Sara Silvestre1

  • 1i3N|CENIMAT, Department of Materials Science, NOVA School of Science and Technology and CEMOP/UNINOVA, Campus de Caparica, Caparica, 2829-516, Portugal.

Advanced Materials (Deerfield Beach, Fla.)
|March 29, 2024
PubMed
Summary
This summary is machine-generated.

Direct Laser Writing (DLW) offers efficient, high-resolution microfabrication for electronics. This review highlights DLW strategies for synthesizing diverse materials, enabling advanced electronic components and applications.

Keywords:
Direct laser writingbioelectronicselectronicslaserslaser‐material processingmaterial synthesis

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Electrical Engineering

Background:

  • Direct Laser Writing (DLW) is a key microfabrication technique for material synthesis and conversion.
  • Lasers are increasingly used for patterning and assembling functional geometries, particularly in electronics.
  • There is a growing need for efficient, cost-effective, and high-resolution methods in electronics microfabrication.

Purpose of the Study:

  • To review recent advances and strategies in DLW for microfabricating electronic components.
  • To outline laser material growth strategies and DLW processing mechanisms for conductive and semiconducting materials.
  • To explore the diverse range of materials and applications enabled by DLW in electronics.

Main Methods:

  • Surveying recent literature on DLW for electronics microfabrication.
  • Summarizing DLW parameters influencing material synthesis and transformation.
  • Discussing additive and transformative DLW processing mechanisms.
  • Categorizing materials synthesized or transformed via DLW for electronics.

Main Results:

  • DLW enables selective, tailored writing of conductive and semiconducting materials.
  • Various material types, including metallic conductors, metal oxides, transition metal chalcogenides/carbides, and laser-induced graphene, can be fabricated.
  • DLW facilitates applications in electronic components, energy harvesting/storage, sensing, and bioelectronics.
  • Lasers play a multi-step role from material engineering to device processing.

Conclusions:

  • DLW is a versatile and powerful tool for next-generation electronics microfabrication.
  • The technique supports accessible and green manufacturing approaches.
  • Lasers are integral to advanced material engineering and device fabrication for future electronics.