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Updated: Jun 29, 2025

Cross-Modal Multivariate Pattern Analysis
Published on: November 9, 2011
Yanfang Hou1, Hui Tian2, Chengmao Wang2
1School of Electrical and Electronic Engineering, Chongqing University of Technology, Chongqing, China.
This study introduces a novel associative memory model using semi-tensor product (STP) matrices for intelligent systems. The new model offers improved information storage and association capabilities compared to traditional discrete Hopfield neural networks (DHNNs).
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