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Related Concept Videos

Properties of Organometallic Compounds01:23

Properties of Organometallic Compounds

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Organometallic compounds are compounds that contain a carbon–metal bond. Carbon belongs to an organyl group like alkyl, aryl, allyl, or benzyl groups. The metal can be from Group I or Group II of the periodic table, a transition metal, or a semimetal.
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Extraction: Advanced Methods00:56

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Metal ions can be separated from one another by complexation with organic ligands–the chelating agent– to form uncharged chelates. Here, the chelating agent must contain hydrophobic groups and behave as a weak acid, losing a proton to bind with the metal. Since most organic ligands used in this process are insoluble or undergo oxidation in the aqueous phase, the chelating agent is initially added to the organic phase and extracted into the aqueous phase. The metal-ligand complex is...
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Different monodentate and polydentate ligands are used as complexing agents in complexometric titration reactions. The formation of complexes by mono- and bidentate ligands involves two or more intermediate steps, limiting their use as complexing agents. In comparison, polydentate ligands can form complexes with metal ions in a single-step process, facilitating sharper end points. This means polydentate ligands, such as amino carboxylic acid derivatives, are most commonly employed in...
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The hemoglobin in the blood, the chlorophyll in green plants, vitamin B-12, and the catalyst used in the manufacture of polyethylene all contain coordination compounds. Ions of the metals, especially the transition metals, are likely to form complexes.
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Multi-Objective Optimization for Rapid Identification of Novel Compound Metals for Interconnect Applications.

Akash Ramdas1, Guanyu Zhou2, Yansong Li2

  • 1Department of Materials Science and Engineering, Stanford University, Stanford, CA, 94305, USA.

Small (Weinheim an Der Bergstrasse, Germany)
|April 9, 2024
PubMed
Summary

Researchers discovered new interconnect materials for integrated circuits by screening over 15,000 candidates. These novel materials show promise for outperforming current copper and ruthenium interconnects in advanced logic devices.

Keywords:
copper alternativesinterconnectsmaterials discoverymm‐Wavemulti‐objective

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Area of Science:

  • Materials Science
  • Condensed Matter Physics
  • Electrical Engineering

Background:

  • Interconnect materials are crucial for integrated circuits, but traditional conductors like copper face limitations at nanoscale dimensions (<10 nm).
  • The poor performance of scaled-down conductors hinders the further miniaturization and scalability of logic devices.

Purpose of the Study:

  • To discover novel interconnect materials capable of overcoming the limitations of current technologies.
  • To identify materials that optimize bulk electronic conductivity, surface scattering time, and chemical stability for advanced integrated circuits.

Main Methods:

  • A multi-objective search strategy was employed, integrating first-principles calculations to screen over 15,000 potential materials.
  • Physically motivated surrogate properties were utilized to simultaneously optimize key performance metrics from accessible materials databases.

Main Results:

  • The screening identified promising local interconnect candidates that could outperform ruthenium, the current standard.
  • Potential semi-global interconnects with significant skin depths at GHz frequencies were also discovered.
  • The material Cobalt Platinum (CoPt) was validated as a promising candidate through ab initio and experimental transport studies.

Conclusions:

  • The developed multi-objective search approach effectively identifies next-generation interconnect materials.
  • The identified materials, including CoPt, have the potential to replace ruthenium and copper in future local interconnect applications.
  • This work paves the way for overcoming scalability limitations in advanced integrated circuits.