Multi-Objective Optimization for Rapid Identification of Novel Compound Metals for Interconnect Applications

Akash Ramdas1, Guanyu Zhou2, Yansong Li2

  • 1Department of Materials Science and Engineering, Stanford University, Stanford, CA, 94305, USA.

Summary

Researchers discovered new interconnect materials for integrated circuits by screening over 15,000 candidates. These novel materials show promise for outperforming current copper and ruthenium interconnects in advanced logic devices.

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