Related Experiment Video
Updated: Jun 28, 2025

Author Spotlight: Accelerating Discovery in Microporous Material Chemistry
Published on: October 6, 2023
Multi-Objective Optimization for Rapid Identification of Novel Compound Metals for Interconnect Applications
Akash Ramdas1, Guanyu Zhou2, Yansong Li2
1Department of Materials Science and Engineering, Stanford University, Stanford, CA, 94305, USA.
Researchers discovered new interconnect materials for integrated circuits by screening over 15,000 candidates. These novel materials show promise for outperforming current copper and ruthenium interconnects in advanced logic devices.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Electrical Engineering
Background:
- Interconnect materials are crucial for integrated circuits, but traditional conductors like copper face limitations at nanoscale dimensions (<10 nm).
- The poor performance of scaled-down conductors hinders the further miniaturization and scalability of logic devices.
Purpose of the Study:
- To discover novel interconnect materials capable of overcoming the limitations of current technologies.
- To identify materials that optimize bulk electronic conductivity, surface scattering time, and chemical stability for advanced integrated circuits.
Main Methods:
- A multi-objective search strategy was employed, integrating first-principles calculations to screen over 15,000 potential materials.
- Physically motivated surrogate properties were utilized to simultaneously optimize key performance metrics from accessible materials databases.
Main Results:
- The screening identified promising local interconnect candidates that could outperform ruthenium, the current standard.
- Potential semi-global interconnects with significant skin depths at GHz frequencies were also discovered.
- The material Cobalt Platinum (CoPt) was validated as a promising candidate through ab initio and experimental transport studies.
Conclusions:
- The developed multi-objective search approach effectively identifies next-generation interconnect materials.
- The identified materials, including CoPt, have the potential to replace ruthenium and copper in future local interconnect applications.
- This work paves the way for overcoming scalability limitations in advanced integrated circuits.
More Related Videos
10:31Detection and Recovery of Palladium, Gold and Cobalt Metals from the Urban Mine Using Novel Sensors/Adsorbents Designated with Nanoscale Wagon-wheel-shaped Pores
Published on: December 6, 2015
12:18Co-localizing Kelvin Probe Force Microscopy with Other Microscopies and Spectroscopies: Selected Applications in Corrosion Characterization of Alloys
Published on: June 27, 2022
Related Concept Videos
Properties of Organometallic Compounds
Extraction: Advanced Methods
Complexometric Titration: Ligands
Metal-Ligand Bonds
In these complexes, transition metals form coordinate covalent bonds, a kind of Lewis acid-base interaction in which both of the electrons in the bond are contributed by a donor (Lewis base) to an electron acceptor (Lewis acid). The Lewis acid in...