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Fusion of Multimodal Imaging and 3D Digitization Using Photogrammetry.

Roland Ramm1, Pedro de Dios Cruz1, Stefan Heist1

  • 1Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Albert-Einstein-Str. 7, 07745 Jena, Germany.

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|April 13, 2024
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Summary
This summary is machine-generated.

This study presents a novel method for superimposing low-resolution multimodal camera data onto high-resolution 3D models. This data fusion technique achieves sub-pixel accuracy, enhancing 3D digitization capabilities.

Keywords:
3D digitizationmulti-sensor systemsmultimodalmultimodal image fusionmultispectralphotogrammetrystructure from motion

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Area of Science:

  • Optics and Photonics
  • Computer Vision
  • 3D Reconstruction

Background:

  • Multimodal sensors capture diverse scene characteristics, but integrating their data with high-resolution 3D models is challenging.
  • Low resolution and image quality of multimodal cameras (hyperspectral, thermal) limit their direct use with detailed 3D data.

Purpose of the Study:

  • To develop and demonstrate a new method for superimposing multimodal image data onto 3D models generated via multi-view photogrammetry.
  • To overcome the resolution limitations of multimodal cameras in 3D digitization applications.

Main Methods:

  • A novel superimposition technique was developed to fuse low-resolution multimodal imagery with high-resolution 3D models.
  • A laboratory setup integrated a high-resolution photo camera, a thermal camera, and a 12-channel multispectral camera on a calibrated rig.
  • Multi-view photogrammetry was used to create a detailed 3D model, onto which multimodal data was superimposed.

Main Results:

  • The data fusion method achieved an accuracy better than one pixel for multimodal superimposition.
  • Successful demonstration of multimodal 3D digitization using integrated camera systems.

Conclusions:

  • The proposed method effectively integrates multimodal sensor data with high-resolution 3D models, enhancing information gain.
  • This approach offers a pathway for advanced 3D digitization with improved material and condition analysis.