Protocol to develop a moisture-desorptive passive cooling system for electronics thermal management

Passive thermal management with zero-energy consumption and high compactness has drawn increasing attention. Here, we present a protocol to develop a hygroscopic salt-loaded heat sink with a moisture-permeable membrane encapsulation technique for electronics cooling. We describe steps for preparing lithium bromide solution and heat sink with anti-corrosion graphene coating. We then detail procedures for preparing the hygroscopic salt-loaded membrane-encapsulated heat sinks (HSMHSs). The produced low-cost HSMHS exhibits remarkably high thermal management performance without the risks of leakage and corrosion. For complete details on the use and execution of this protocol, please refer to Sui et al.¹.