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Protocol for nanoscale thermal mapping of electronic devices using atomic force microscopy with phase change material
Qilong Cheng1, Sukumar Rajauria2, Erhard Schreck2
1Department of Mechanical Engineering, University of California at Berkeley, Berkeley, CA 94720, USA; Western Digital Corporation, Recording Sub System Staging and Research, San Jose, CA 95135, USA.
Abstract:
In this protocol, we present a facile nanoscale thermal mapping technique for electronic devices by use of atomic force microscopy and a phase change material Ge2Sb2Te5. We describe steps for Ge2Sb2Te5 thin film coating, Ge2Sb2Te5 temperature calibration, thermal mapping by varying heater power, and thermal mapping by varying heating time. The protocol can be applied for resolving surface temperatures of various operational microelectronic devices with a nanoscale precision. For complete details on the use and execution of this protocol, please refer to Cheng et al.1.

