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Investigation and Prediction of Nano-Silver Line Quality upon Various Process Parameters in Inkjet Printing Process
Jizhuang Hui1, Hao Zhang1, Jingxiang Lv1
1Key Laboratory of Road Construction Technology and Equipment of MOE, Chang'an University, Xi'an, China.
3D Printing and Additive Manufacturing
|May 1, 2024
Summary
Optimizing inkjet printing parameters like temperature and speed is crucial for high-quality conductive lines in microelectronics. This study identifies optimal settings for low resistance and high aspect ratio, aiding integrated circuit fabrication.
Area of Science:
- Additive Manufacturing
- Microelectronics Engineering
Background:
- Inkjet printing is a key additive manufacturing technology for microelectronics.
- Achieving desired conductive line quality (width, thickness, resistance) is challenging due to droplet behavior and parameter interactions.
Purpose of the Study:
- To investigate the impact of process parameters on conductive line quality in inkjet printing.
- To determine optimal parameters for fabricating high-quality conductive lines for integrated circuits.
Main Methods:
- A full factorial experiment was conducted, analyzing platform temperature, printing speed, number of layers, and delay time.
- An artificial neural network (ANN) was developed to predict printed line quality.
Main Results:
- Line thickness increases with the number of layers, but line width does not.
- Optimal parameters (70°C platform temp, 12.2 ms delay, 1139.39 mm/min speed, 5 layers) yield low resistance and high aspect ratio.
- The ANN model accurately predicts line width and thickness, with limitations for resistance prediction due to irregular edges.
Conclusions:
- This research provides essential guidance for selecting inkjet printing parameters to achieve specific conductive line properties.
- The findings facilitate the realization of diverse quality attributes for 3D printed conductive lines in integrated circuits.
