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Updated: Jun 26, 2025

Fabrication and Testing of Photonic Thermometers
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Mechanically-flexible wafer-scale integrated-photonics fabrication platform.

Milica Notaros1, Thomas Dyer2, Andres Garcia Coleto1

  • 1Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.

Scientific Reports
|May 9, 2024
PubMed
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Researchers developed the first wafer-scale fabrication process for mechanically-flexible integrated photonics. This breakthrough enables new applications in wearable devices and flexible electronics by overcoming the limitations of rigid silicon-based platforms.

Area of Science:

  • Integrated photonics
  • Materials science
  • Wafer-scale fabrication

Background:

  • Integrated photonics has advanced using wafer-scale fabrication for infrared and visible wavelengths.
  • Current platforms on silicon substrates result in rigid photonic wafers and chips, limiting applications.
  • Existing flexible photonics fabrication is limited to chip-scale, hindering scalability.

Purpose of the Study:

  • To develop and characterize the first 300-mm wafer-scale platform for mechanically-flexible integrated photonics.
  • To enable new applications requiring pliable photonic devices, such as wearable healthcare monitors and displays.

Main Methods:

  • Developed a 300-mm wafer-scale CMOS-compatible flexible platform and fabrication process.
  • Experimentally demonstrated optical functionality (chip coupling, waveguide routing, passive devices) at visible wavelengths.

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Last Updated: Jun 26, 2025

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  • Conducted bend-durability tests and characterized polarization-rotation effects under bending.

    • Main Results:

    • Successfully created the first wafer-scale flexible integrated photonics platform.
    • Demonstrated key optical functionalities on flexible photonic chips.
    • Photonic chips withstood 2000 bends to a 0.5-inch diameter with no optical performance degradation.

    Conclusions:

    • The developed platform and process enable wafer-scale production of mechanically-flexible photonic chips.
    • This advancement opens integrated photonics to new application domains requiring flexibility and durability.
    • The study overcomes scalability limitations in flexible photonics fabrication.