Segmentation of void defects in X-ray images of chip solder joints based on PCB-DeepLabV3 algorithm

Defects within chip solder joints are usually inspected visually for defects using X-ray imaging to obtain images. The phenomenon of voids inside solder joints is one of the most likely types of defects in the soldering process, and accurate detection of voids becomes difficult due to their irregular shapes, varying sizes, and defocused edges. To address this problem, an X-ray void image segmentation algorithm based on improved PCB-DeepLabV3 is proposed. Firstly, to meet the demand for lightweight and easy deployment in industrial scenarios, mobilenetv2 is used as the feature extraction backbone network of the PCB-DeepLabV3 model; then, Attentional multi-scale two-space pyramid pooling network (AMTPNet) is designed to optimize the shallow feature edges and to improve the ability to capture detailed information; finally, image cropping and cleaning methods are designed to enhance the training dataset, and the improved PCB-DeepLabV3 is applied to the training dataset. The improved PCB-DeepLabV3 model is used to segment the void regions within the solder joints and compared with the classical semantic segmentation models such as Unet, SegNet, PSPNet, and DeeplabV3. The proposed new method enables the solder joint void inspection to get rid of the traditional way of visual inspection, realize intelligent upgrading, and effectively improve the problem of difficult segmentation of the target virtual edges, to obtain the inspection results with higher accuracy.