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Advancing LED technology: the FDCSP element's breakthrough in mini and micro-LED packaging and backlight module

Jo-Hsiang Chen1, Che-Hsuan Huang1, Tzu-Yi Lee1,2

  • 1Department of Photonics, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan.

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Summary

This study presents a new method for designing free-form lighting components using energy conservation principles, ideal for micro-light-emitting diode (LED) packaging. The developed algorithm creates integrated LED and lens components, optimizing performance for advanced display and lighting applications.

Keywords:
Chip scale packageEnergy conservationFreeform-designLight emitting diodeLight source calculationMini LED

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Area of Science:

  • Optical Engineering
  • Materials Science

Background:

  • Traditional lighting design methods often struggle with complex free-form surfaces.
  • Micro-light-emitting diode (LED) packaging demands innovative solutions for enhanced light extraction and thermal management.

Purpose of the Study:

  • To develop an advanced methodology for calculating bulk light sources for free-form surface design.
  • To create an algorithm for designing freeform-designed chip-scale package (FDCSP) components integrating LEDs and lenses.
  • To optimize these components for micro-LED packaging and backlight modules using energy conservation principles.

Main Methods:

  • Utilized the principle of energy conservation for accurate light source calculations.
  • Developed an iterative algorithm employing layering techniques for design refinement.
  • Validated simulation outcomes against target functions using difference curves.

Main Results:

  • Successfully designed and demonstrated innovative FDCSP devices.
  • Achieved close alignment between simulated results and target functions through iterative design.
  • Showcased the applicability of FDCSP devices in both traditional backlight modules and emerging micro-LED packaging.

Conclusions:

  • The developed methodology offers a robust approach to free-form surface design in lighting.
  • The FDCSP components are highly effective for micro-LED packaging, promising advancements in display and lighting technology.
  • This research contributes to energy-efficient lighting design and enables next-generation micro-LED applications.