Synchronously enhancing thermal conductivity and dielectric properties in epoxy composites via incorporation of...

Polymer-like dielectrics with superb thermal conductivity as well as high dielectric properties hold great promise for the modern electronic field. Nevertheless, integrating these properties into a single material simultaneously remains problematic due to their mutually limited physical connotations. In this study, we developed high-quality thermally conductive epoxy composites with excellent dielectric properties. This was achieved by incorporating surface-functionalized microscale hexagonal boron nitride (BN) along with N-[3-(Trimethoxysilyl)propyl]ethylene diamine (DN) and N-[3-(Trimethoxysilyl)propyl]aniline (PN). In the resulting epoxy composite, microscale BN serves as the primary building block for establishing the thermally conductive network, while silica particles act as bridges to regulate heat transfer and reduce interfacial phonon-scattering. The prepared composites were thoroughly examined across various filler contents (ranging from 10 to 80 wt%). Among them, the DNBN/epoxy composite exhibited higher thermal conductivity (in-plane: 47.03 W m^-1 K^-1) at 60 wt% filler content compared to BN/epoxy (39.40 W m^-1 K^-1) and PNBN/epoxy (33 W m^-1 K^-1) composites. These results highlight the usefulness of surface modification of BN in improving compatibility between fillers and epoxy, ultimately reducing composite viscosity. Furthermore, the DNBN/epoxy composite at 60 wt% demonstrated superb dielectric constant (∼6.15) without compromising on dissipation loss (∼0.06). The strategy adopted in this study offers significant insights into designing dielectric thermally conductive composites with superior performance outcomes.