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Updated: Jun 24, 2025

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Contact Angle Modulation: In Situ Polymer Deposition during Sessile Drop Evaporation.

Shakshi Gupta1,2, Subramanyan Namboodiri Varanakkottu3, Ethayaraja Mani4,2

  • 1Soft Material Laboratory, Department of Physics, IIT Madras, Chennai 600036, India.

Langmuir : the ACS Journal of Surfaces and Colloids
|June 5, 2024
PubMed
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This study reveals unconventional drying dynamics where the contact angle increases as a sessile drop shrinks. This phenomenon, driven by polymer deposition, offers new insights into evaporation and surface interactions.

Area of Science:

  • Surface Science
  • Fluid Dynamics
  • Materials Science

Background:

  • Sessile drop drying is crucial for coating, printing, and microfluidics.
  • Drying typically follows constant contact radius (CCR) or constant contact angle (CCA) modes.
  • Both radius and contact angle can decrease during advanced drying stages.

Purpose of the Study:

  • To investigate unconventional drying kinetics of aqueous polymer solutions on high surface energy substrates.
  • To characterize scenarios where contact angle increases while radius decreases during drying.
  • To elucidate the underlying mechanisms of this anomalous drying behavior.

Main Methods:

  • Experimental observation of sessile drop drying dynamics.
  • Utilized various polymer systems (e.g., PEO, PVP) with varying molecular weights and concentrations.

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  • In situ monitoring of contact angle and radius changes during evaporation.

    • Main Results:

    • Observed a novel drying mode where contact angle (θ) increases as the contact radius (R) decreases.
    • This behavior was consistent across different polymer solutions and concentrations.
    • Polymer deposition at the contact line reduced substrate surface energy, inducing the contact angle increase.

    Conclusions:

    • Evaporation-induced polymer deposition can lead to an increasing contact angle during sessile drop drying.
    • This in situ modulation of contact angle demonstrates unconventional drying dynamics.
    • Findings have implications for controlling deposition patterns in coating and printing technologies.