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Updated: Jun 24, 2025

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High-resolution, High-speed, Three-dimensional Video Imaging with Digital Fringe Projection Techniques
Published on: December 3, 2013
15.7K
Multi-view fringe projection profilometry for surfaces with intricate structures and high dynamic range.
Optics Express
|June 11, 2024
Summary
This study introduces a multi-view fringe projection profilometry system to overcome challenges in measuring complex, high dynamic range objects. The new system achieves accurate 3D measurements, improving quality control in precision manufacturing.
Area of Science:
- Optical Metrology
- 3D Measurement Technologies
- Quality Control Systems
Background:
- Fringe projection profilometry is crucial for production line quality control.
- Challenges exist in measuring intricate structures and high dynamic range surfaces.
- Existing methods struggle with shadowing, occlusion, and specular reflections.
Purpose of the Study:
- To develop a multi-view fringe projection profilometry system to address measurement limitations.
- To enable accurate 3D measurement of complex and high dynamic range objects.
- To improve quality control in precision manufacturing and semiconductor packaging.
Main Methods:
- A multi-view system with a vertical telecentric projector and four oblique tilt-shift cameras was designed.
- A flexible calibration method using a corrected pinhole imaging model for telecentric projection was developed.
- Unified system calibration was achieved through bundle adjustment.
Main Results:
- The system achieved a 3D repeated measurement error and standard deviation of no more than 10 μm.
- Measurements were accurate within a volume of 70 × 40 × 20 mm³.
- Complete and accurate 3D measurements of high dynamic range surfaces with complex structures were demonstrated.
Conclusions:
- The developed multi-view fringe projection profilometry system effectively overcomes limitations of traditional methods.
- The system provides high accuracy and completeness for 3D measurements of challenging surfaces.
- This technology enhances quality control capabilities in precision manufacturing and semiconductor packaging.
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