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Thermally Coupled NTC Chip Thermistors: Their Properties and Applications
Milan Z Bodić1, Stanko O Aleksić2, Vladimir M Rajs1
1Faculty of Technical Sciences, University of Novi Sad, 21102 Novi Sad, Serbia.
Sensors (Basel, Switzerland)
|June 19, 2024
Summary
A novel device uses two thermally coupled negative temperature coefficient (NTC) chip thermistors for microelectronics. This thermally coupled NTC thermistor device enables electrical decoupling and thermal coupling of signals.
Area of Science:
- Materials Science
- Electrical Engineering
- Microelectronics
Background:
- Negative temperature coefficient (NTC) chip thermistors are crucial components in temperature sensing.
- Developing novel devices for microelectronics requires innovative thermal management solutions.
Purpose of the Study:
- To create and characterize a new device using thermally coupled NTC chip thermistors.
- To evaluate its potential for signal decoupling and thermal coupling in microelectronic applications.
Main Methods:
- Constructed a device with two electrically isolated, thermally coupled NTC chip thermistors (Th1 and Th2).
- Measured thermistor resistance (R) versus temperature (T) and determined the exponential factor B10/30.
- Analyzed self-heating behavior of the input thermistor (Th1) and heat transfer to the output thermistor (Th2).
- Utilized the Steinhart-Hart equation to determine thermistor temperatures (T1, T2).
Main Results:
- Characterized the thermal and electrical properties of the thermally coupled NTC thermistor device.
- Quantified heat transfer, thermal response, stability, and inaccuracy of the system.
- Demonstrated the device's capability for input-to-output electrical decoupling and thermal coupling.
Conclusions:
- The novel thermally coupled NTC chip thermistor device shows promise for microelectronic applications.
- It offers a unique solution for managing signals requiring electrical isolation and controlled thermal interaction.
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