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Related Experiment Video

Updated: Jun 21, 2025

Scalable Quantum Integrated Circuits on Superconducting Two-Dimensional Electron Gas Platform

Scalable Quantum Integrated Circuits on Superconducting Two-Dimensional Electron Gas Platform

Published on: August 2, 2019

Scalable interconnection using a superconducting flux qubit.

Daisuke Saida^1,2, Kazumasa Makise^3,4, Mutsuo Hidaka³

¹Fujitsu Limited, 1-1, Kamikodanaka 4-chome, Nakahara-ku, Kawasaki, Kanagawa, 211-8588, Japan. saida.daisuke@fujitsu.com.

Scientific Reports

|July 16, 2024

Summary

Researchers developed a new 2.5D superconducting quantum computing technology using flux qubits and flip-chip bonding. This method overcomes scaling bottlenecks, enabling more qubits for advanced quantum annealing and gate-based quantum computers.

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Area of Science:

Quantum Computing
Superconducting Circuits
Quantum Annealing

Background:

Superconducting quantum computers face fabrication bottlenecks as qubit numbers increase.
Scalable implementation technology is crucial for improving quantum computer performance.
2.5-dimensional (2.5D) implementation enhances circuit scalability through increased routing freedom.

Purpose of the Study:

To introduce an implementation technology that overcomes scaling bottlenecks in superconducting quantum computers.
To demonstrate a reliable connection qubit for enhanced scalability.
To explore the application of this technology in quantum annealing and potentially gate-type qubits.

Main Methods:

Utilized quantum annealing with a superconducting flux qubit for qubit interconnection.
Implemented precise control over qubit coupling status.
Employed low-temperature flip-chip bonding for 2.5D interconnections between chips.

Main Results:

Demonstrated proof-of-concept qubit coupling via flux qubit interconnection.
Achieved strict controllability of coupling status through quantum annealing.
Successfully demonstrated a superconducting flux qubit across two chips via flip-chip bonding, exhibiting state transitions similar to conventional qubits.

Conclusions:

The developed quantum annealing flux qubit and flip-chip bonding technology enable novel qubit interconnections.
This 2.5D implementation approach effectively addresses scaling bottlenecks in superconducting quantum computing.
The technology holds potential for connecting gate-type qubits, paving the way for larger-scale quantum processors.