Scalable Fabrication of Large-Scale, 3D, and Stretchable Circuits

Area of Science:

• Materials Science
• Electrical Engineering
• Wearable Technology

Background:

• Stretchable electronics are crucial for wearable healthcare and conformal integration.
• Scalable fabrication of high-density stretchable devices is essential for practical applications.

Purpose of the Study:

• To report a comprehensive methodology for large-scale, 3D, and stretchable circuits (3D-LSC).
• To enable batch production of advanced stretchable electronic devices.

Main Methods:

• Utilizing soft copper-clad laminate (S-CCL) with a "cast and cure" process for large-scale planar interconnects (>1 m).
• Implementing through, buried, and blind vias for vertical interconnects in multilayer S-CCLs.
• Employing a temporary bonding substrate to mitigate strain-induced misalignments.

Main Results:

• Demonstrated patterning of planar interconnects exceeding 1 meter scale.
• Achieved high functional density through multilayer stacking and vertical interconnects.
• Enabled batch production of five-layer stretchable circuits for skin patches.

Conclusions:

• The 3D-LSC methodology provides a scalable approach for fabricating complex stretchable electronics.
• The developed technology supports miniaturized systems for physiological monitoring and wireless power delivery.
• Conformal antennas and stretchable displays highlight the broad potential of 3D-LSC for large-scale applications.