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Vertical Interconnection Technology for RF MicroSystem Packaging.

Yongfang Hu1,2, Wei Sun2, Yipeng Sun1,2

  • 1School of Electronic Science & Engineering, Southeast University, Nanjing 210096, China.

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|July 27, 2024
PubMed
Summary
This summary is machine-generated.

This study developed reliable 1.5-level interconnections for millimeter wave RF microsystems. Optimized solder ball interconnections ensure high performance and reliability for future wireless communication devices.

Keywords:
RF microsystemsystem in packagevertical interconnection

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Area of Science:

  • Electrical Engineering
  • Materials Science
  • Microsystems Engineering

Background:

  • Advancements in wireless communication necessitate high-performance microsystems operating in the millimeter wave band.
  • Existing interconnection technologies face challenges in achieving the required RF performance, integration compatibility, and reliability.

Purpose of the Study:

  • To develop and optimize 1.5-level interconnections for RF microsystems.
  • To ensure good RF performance, integration process compatibility, and high reliability for millimeter wave applications.

Main Methods:

  • Numerical modeling of 1.5-level interconnections using High Frequency Structure Simulator (HFSS).
  • Analysis of solder balls with varying diameters, including Sn96.5Ag3Cu0.5 (SAC305) and Sn63Pb37.
  • Optimization of interconnection structure parameters and integration process parameters for vertical interconnections.

Main Results:

  • Optimized structure parameters were identified for SAC305 (0.2 mm diameter) and Sn63Pb37 (0.3 mm diameter) solder balls.
  • Successful interconnection between glass and silicon micro substrates, and between silicon and High-Temperature Co-fired Ceramic (HTCC) substrates.
  • Manufactured micro substrate interconnection samples demonstrated high reliability.

Conclusions:

  • The developed 1.5-level interconnections meet the demands for millimeter wave wireless communication microsystems.
  • Optimized solder ball interconnections and integration processes are crucial for achieving high RF performance and reliability.
  • This work provides a reliable interconnection solution for advanced RF microsystem integration.