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Updated: Jun 18, 2025

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
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Vertical Interconnection Technology for RF MicroSystem Packaging

Yongfang Hu1,2, Wei Sun2, Yipeng Sun1,2

  • 1School of Electronic Science & Engineering, Southeast University, Nanjing 210096, China.

Materials (Basel, Switzerland)
|July 27, 2024
PubMed

Keywords:
RF microsystemsystem in packagevertical interconnection

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