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Thick Glass High-Quality Cutting by Ultrafast Laser Bessel Beam Perforation-Assisted Separation
Suwan Chen1,2, Yuxuan Luo1,2, Xinhu Fan1,2
1State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China.
Micromachines
|July 27, 2024
Summary
Researchers achieved high-quality thick glass cutting using ultrafast laser perforation and CO2 laser separation. This novel method improves cutting thickness and quality for industrial applications.
Area of Science:
- Materials Science
- Laser Physics
- Manufacturing Engineering
Background:
- Thick glass cutting is crucial in aerospace and optics.
- Ultrafast laser Bessel beams offer potential but require improved cutting thickness and quality.
Purpose of the Study:
- To achieve high-quality cutting of thick glass.
- To investigate a novel method combining ultrafast laser perforation and CO2 laser separation.
Main Methods:
- Used an infrared picosecond laser Bessel beam for glass perforation.
- Employed a CO2 laser to induce crack propagation along the perforated path.
- Investigated the effects of hole spacing, pulse energy, and defocusing distance on surface roughness.
Main Results:
- Successfully realized high-quality cutting of 6 mm thick soda-lime glass.
- Identified optimal cutting parameters.
- Achieved a minimum surface roughness of 343 nm in the cross-section.
Conclusions:
- The combined ultrafast laser perforation and CO2 laser separation method enables high-quality thick glass cutting.
- This technique offers a significant advancement over existing methods.
- Further optimization of parameters can enhance cutting performance.
