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A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

Published on: August 28, 2018

Atomic Precision Processing of Two-Dimensional Materials for Next-Generation Microelectronics.

Jinkyoung Yoo¹, Chang-Yong Nam², Ezra Bussmann³

¹Center for Integrated Nanotechnologies, Los Alamos National Laboratory, Los Alamos, New Mexico 87545, United States.

|August 6, 2024

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Advanced materials like 2D transition metal dichalcogenides (TMDCs) are key for future microelectronics. Atomic Precision Processing (APP) techniques enable precise fabrication and modification of these materials for enhanced device performance and energy efficiency.

Area of Science:

Materials Science
Microelectronics Engineering
Nanotechnology

Background:

The information era economy demands advanced materials for microelectronics, driving research beyond current Complementary Metal-Oxide-Semiconductor (CMOS) limits.
Atomically thin 2D materials, including transition metal dichalcogenides (TMDCs), offer unique properties and defect engineering potential for next-generation semiconductor devices.
Exploration of "Beyond CMOS" and "More than Moore" paradigms necessitates novel fabrication and modification techniques for these advanced materials.

Purpose of the Study:

To provide a perspective on Atomic Precision Processing (APP) techniques for fabricating and modifying 2D materials.
To highlight the role of APP in enabling high-performance and energy-efficient 2D material-based microelectronics.
To discuss the integration of APP with metrology and codesign for future semiconductor manufacturing.

Keywords:

atomic layer deposition atomic layer etching atomic precision advanced manufacturing electronic devices semiconductors two-dimensional materials

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Last Updated: Jun 17, 2025

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

Published on: August 28, 2018

Atomically Traceable Nanostructure Fabrication

Atomically Traceable Nanostructure Fabrication

Published on: July 17, 2015

Processing of Bulk Nanocrystalline Metals at the US Army Research Laboratory

Processing of Bulk Nanocrystalline Metals at the US Army Research Laboratory

Published on: March 7, 2018

Main Methods:

Review of additive APP techniques: atomic layer deposition (ALD) and epitaxy for controlled growth of 2D materials.
Analysis of subtractive APP techniques: atomic layer etching (ALE) for precise material removal and patterning.
Exploration of atomic precision advanced manufacturing (APAM) for defect control and tailored 2D material properties.

Main Results:

Additive APP methods (ALD, epitaxy) enable atomic-scale control over composition, crystallinity, and thickness, crucial for device integration.
Subtractive APP methods (ALE) allow for precise etching, enhancing 2D material functionality and manufacturability.
APAM techniques facilitate atomic-scale defect engineering, leading to customized device functions and improved performance.

Conclusions:

Atomic Precision Processing (APP) is essential for realizing the full potential of 2D materials in next-generation microelectronics.
A holistic approach combining fundamental understanding, process modeling, and advanced metrology is required for optimal performance and energy efficiency.
Continued development in APP and its integration with metrology and codesign frameworks will accelerate the advancement of 2D material-based semiconductor technology.