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Elastic Property Evaluation of Fiberglass and Epoxy Resin Composite Material Using Digital Image Correlation
Dalferson Yoras1, Sylwia Makowska2, Agnė Kairytė3
1Group on Mechanics of Materials and Structures, Campus Cachoeira do Sul, Federal University of Santa Maria, Cachoeira do Sul 96503-205, Brazil.
Digital Image Correlation (DIC) shows limitations in measuring composite material deformation, with differences compared to analog extensometers. Further research is needed to refine DIC for accurate composite mechanical property analysis.
Area of Science:
- Materials Science
- Mechanical Engineering
- Composite Materials
Background:
- Digital Image Correlation (DIC) is a non-contact optical method for measuring deformation.
- Traditional analog extensometers are widely used for mechanical testing.
- Composite materials offer high strength-to-weight ratios but require precise characterization.
Purpose of the Study:
- Evaluate the sensitivity and limitations of simplified Digital Image Correlation (DIC) equipment.
- Compare DIC measurements with analog extensometer data for fiberglass/epoxy composites.
- Validate experimental results against Classical Laminate Theory (CLT).
Main Methods:
- Fabricated composite plates ([0]3, [90]4, [±45]3) via manual lamination.
- Conducted tensile tests following ASTM D3039 and D3518 standards.
- Employed DIC to capture strain fields and compared with analog extensometer readings.
Main Results:
- DIC showed discrepancies: 11.1% for longitudinal modulus (E1) and 5.6% for transverse modulus (E2).
- DIC exhibited lower efficiency under low deformation due to equipment limitations.
- CLT predicted a longitudinal modulus (Ex) of 7136 MPa for [±45]3 laminate, versus 5208 MPa experimentally (31.2% difference).
Conclusions:
- Simplified DIC equipment has limitations affecting accuracy in composite mechanical testing.
- Analog extensometers remain reliable, but DIC offers potential for non-contact analysis.
- Discrepancies between experimental data and CLT highlight the need for improved composite modeling and DIC techniques.
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