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Published on: March 19, 2017
Size-Dependent Isovalent Impurity Doping for Ambipolar Control in Cu3N.
Kosuke Matsuzaki1, Chen-Wei Chang2, Teruya Nagafuji3
1National Institute of Advanced Industrial Science and Technology, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8568, Japan.
This study introduces a novel doping method for copper nitride semiconductors using isovalent alkali metal impurities. Size-dependent doping with lithium, cesium, and rubidium enables precise control over n-type and p-type conductivity for advanced semiconductor applications.
Area of Science:
- Materials Science
- Solid State Physics
- Semiconductor Physics
Background:
- Substitutional doping with aliovalent impurities is key for semiconductor ambipolar control.
- Monovalent cation compounds face limitations in p-type doping due to a lack of suitable aliovalent impurities.
Purpose of the Study:
- To explore an alternative doping strategy for Cu(I)-based semiconductors using isovalent alkali metal impurities.
- To achieve controllable p-type and n-type doping in copper nitride via impurity size manipulation.
Main Methods:
- Investigated doping effects of isovalent lithium (Li), cesium (Cs), and rubidium (Rb) in copper nitride.
- Utilized first-principles calculations to understand impurity behavior and defect formation.
- Controlled electron and hole concentrations through impurity size variations.
Main Results:
- Smaller Li impurities at interstitial positions enhanced n-type conductivity (10^15 to 10^18 cm^-3).
- Larger Cs and Rb impurities induced p-type conversion (10^14 to 10^17 cm^-3) by forming acceptor defect complexes.
- Li acts as a shallow donor, while Cs/Rb promote Cu vacancies due to ionic repulsion.
Conclusions:
- Isovalent impurity size-dependent doping offers a new route for semiconductor doping.
- This method provides tunable n-type and p-type conductivity in monovalent cation compounds.
- Enables advancements in optoelectronic devices utilizing copper nitride and similar semiconductors.
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