Hot Deformation Behavior and Microstructure Evolution of a Graphene/Copper Composite.

Area of Science:

• Materials Science
• Metallurgy
• Nanocomposites

Background:

• Graphene/copper composites offer superior conductivity for electronics and energy applications.
• Microstructure control during thermal mechanical processing (TMP) is critical for manufacturing high-performance composites.
• Understanding hot deformation behavior is essential for optimizing composite properties.

Purpose of the Study:

• To investigate the hot deformation behavior of graphene/copper composites.
• To establish a constitutive equation and hot processing map for these composites.
• To determine optimal processing parameters for achieving a uniform, fine-grained microstructure.

Main Methods:

• Isothermal compression tests were conducted at temperatures ranging from 700 to 850 °C and strain rates from 0.01 to 10 s^-1.
• An Arrhenius model was used to establish a constitutive equation describing the deformation behavior.
• A hot processing map was developed to identify optimal processing windows.

Main Results:

• The primary deformation mechanism identified was dynamic recrystallization (DRX).
• The established Arrhenius model accurately described the DRX-mediated deformation.
• Strain rate significantly influenced the DRX grain size more than deformation temperature.
• Optimal conditions for a uniform microstructure with fine grains were found to be 800 °C and 1 s^-1.

Conclusions:

• Dynamic recrystallization (DRX) is the dominant mechanism in the hot deformation of graphene/copper composites.
• The constitutive equation and hot processing map provide valuable tools for optimizing TMP.
• Specific processing parameters (800 °C, 1 s^-1) yield superior microstructural characteristics for enhanced performance.