Fatigue
Design Consideration
Yield Criteria for Ductile Materials under Plane Stress
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Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
Published on: April 13, 2016
Qinghua Su1, Cadmus Yuan2, Kuo-Ning Chiang1
1Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu City 30013, Taiwan.
This study uses adaptive sampling and machine learning to accurately predict solder joint fatigue life in advanced packaging, reducing computational costs associated with large datasets. Ensemble learning further enhances model performance.
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