A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon

Precision processing of monocrystalline silicon presents significant challenges due to its unique crystal structure and chemical properties. Effective modeling and simulation are essential for advancing the understanding of the manufacturing process, optimizing design, and refining production parameters to enhance product quality and performance. This review provides a comprehensive analysis of the modeling and simulation techniques applied in the precision machining of monocrystalline silicon using diamond wire sawing. Firstly, the principles of mathematical analytical model, molecular dynamics, and finite element methods as they relate to monocrystalline silicon processing are outlined. Subsequently, the review explores how mathematical analytical models address force-related issues in this context. Molecular dynamics simulations provide valuable insights into atomic-scale processes, including subsurface damage and stress distribution. The finite element method is utilized to investigate temperature variations and abrasive wear during wire cutting. Furthermore, similarities, differences, and complementarities among these three modeling approaches are examined. Finally, future directions for applying these models to precision machining of monocrystalline silicon are discussed.