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Constructing the Snail Shell-Like Framework in Thermal Interface Materials for Enhanced Through-Plane Thermal

Zhi-Guo Wang¹, Yaonan Huo², Hai-Feng Nan³

¹School of Aeronautics and Astronautics, Sichuan University, Chengdu 610065, China.

ACS Applied Materials & Interfaces

|August 29, 2024

Summary

Researchers developed a snail shell-inspired thermal interface material (TIM) that doubles thermal conductivity. This novel TIM significantly improves heat dissipation in electronics, preventing overheating.

Keywords:

Boron nitride nanosheets Snail shell-like framework Thermal conductivity Thermal interface materials Vertical arrangement

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Area of Science:

Materials Science
Nanotechnology
Thermal Engineering

Background:

High-power-density electronics require efficient heat dissipation to prevent overheating.
Thermal interface materials (TIMs) are crucial for managing heat, but improving their through-plane thermal conductivity (TC) remains a challenge.

Purpose of the Study:

To develop a novel TIM with enhanced through-plane TC for improved heat dissipation.
To create a snail shell-like framework that facilitates vertical heat conduction.

Main Methods:

A double-microrod-assisted curliness method was used to create spirally coiled boron nitride nanosheet (BNNS)/aramid nanofiber (ANF) laminates.
The method aligned interconnected BNNSs vertically within the TIM framework.
Foygel's nonlinear model was employed to analyze interfacial thermal resistance.

Main Results:

The snail shell-like TIM achieved approximately 100% enhancement in through-plane TC compared to randomly distributed BNNS counterparts.
The novel framework reduced interfacial thermal resistance by four orders of magnitude.
The TIM demonstrated superior thermal dissipation, reducing LED chip temperature by 42.6 °C.

Conclusions:

The developed snail shell-like BNNS framework significantly enhances vertical heat conduction in TIMs.
This approach offers a promising strategy for fabricating high-performance TIMs for reliable electronic device operation.
The study provides a valuable method for improving thermal management in high-power electronics.