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Updated: Jun 13, 2025

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics
Published on: August 28, 2018
Enhancement of tunneling electroresistance in metal/two-dimensional ferroelectric tunnel junctions: route for
Shiying He1,2, Daifeng Zou1,2, Chihou Lei3
1School of Physics and Electronic Science, Hunan University of Science and Technology, Xiangtan 411201, People's Republic of China.
Abstract:
In fabricating ferroelectric tunnel junction (FTJ) devices, it is essential to employ low-resistance metals as electrodes interfacing with two-dimensional (2D) ferroelectric materials. For FTJs with a top contact configuration, two interfaces for charge transport are present, namely the vertical interface between the metal electrode and the 2D ferroelectric material, and the lateral interface between the electrode and the central scattering region. These interfaces significantly influence the tunneling electroresistance (TER) of FTJs. However, there exists a notable deficiency in comprehension concerning the physics of charge transport at the interface. In this work, we explore the interface transport properties in FTJs featuring a top contact configuration between metal and the typicalα-In2Se3monolayer. By employing the non-equilibrium Green's function method, we observe a TER ratio of1.15×105% for the Pd top contact interfacing with anα-In2Se3monolayer. The significant TER effect is attributed to polarization-controlled interface transport, which is further elucidated through an analysis of the transport mechanisms influenced by the out-of-plane polarization ofα-In2Se3at the vertical interface and the in-plane polarization at the lateral interface. This investigation of the fundamental physical mechanisms of polarization-controlled interface transport demonstrates significant potential for enhancing non-volatile memory devices.
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