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Updated: May 3, 2026

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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
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Editorial for the Topic on Advanced Laser Fabrication Technologies for Cross-Field Applications
Zhuo-Chen Ma1,2,3, Xue-Qing Liu4, Bing Han1
1Institute of Medical Robotics, School of Biomedical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.
Micromachines
|September 28, 2024
Abstract:
The field of laser fabrication technologies has seen remarkable advancements in recent years [...].
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