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Updated: May 18, 2026

Picoinjection of Microfluidic Drops Without Metal Electrodes
Published on: April 18, 2014
A Droplet Generator Using Piezoelectric Ceramics to Impact Metallic Pellets
Jilong Yu1, Daicong Zhang1, Wei Guo1
1School of Mechanical & Electronic Engineering, Xi'an Polytechnic University, Xi'an 710048, China.
A novel drop-on-demand droplet generator ejects metallic pellets in an atmospheric environment, overcoming limitations of existing metal micro-droplet ejection technologies. This device offers a simpler, cost-effective solution for micro-fabrication and electronic packaging.
Area of Science:
- Materials Science and Engineering
- Microfabrication Technologies
- Additive Manufacturing
Background:
- Metal micro-droplet ejection is crucial for micro-metal part prototyping and microelectronic packaging.
- Current technologies face challenges including specialized environments, complex feeding, and high costs.
Purpose of the Study:
- To design and analyze a novel drop-on-demand droplet generator for metallic pellets using impact feed ejection.
- To develop a cost-effective and structurally simple device for atmospheric micro-droplet ejection.
Main Methods:
- A micro-channel feeding method utilizing piezoelectric ceramic actuators.
- Rigid dynamics modeling of metallic pellet flight trajectory.
- Computational Fluid Dynamics (CFD) simulation using Fluent to analyze melting and ejection processes.
Main Results:
- Stable droplet generation with a 500 µs pulse width and 1100 mm/s initial velocity.
- Simulation reveals feeding, melting, and ejection stages taking 39.5 ms, 7.85 ms, and 17.65 ms, respectively.
- Projected injection frequency of 15 Hz for the metal projectile droplet-generating device.
Conclusions:
- The developed droplet generator offers a simplified, compact, and cost-effective alternative for metal micro-droplet ejection.
- The device operates effectively in an atmospheric environment, eliminating the need for micro-oxygen conditions.
- This technology shows promise for advancing rapid prototyping and microelectronic packaging applications.
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