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Optimization of W-band interaction structure developed using three different micro-fabrication techniques.

Sahil Jain1,2, Vishant1, Maninder Kaur1

  • 1(CSIR)-Central Electronics Engineering Research Institute (CEERI), Pilani 333031, India.

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|October 1, 2024
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Summary

This study optimized micro-fabrication for W-band structures using micro-electric discharge milling (EDM) and micro-milling. The goal was to achieve precise dimensions and smooth surfaces for advanced beam-wave interaction devices.

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Area of Science:

  • Electrical Engineering
  • Materials Science
  • Physics

Background:

  • W-band (75–110 GHz) devices require precise micro-structures for efficient beam-wave interaction.
  • Micro-fabrication techniques are crucial for developing these complex structures.
  • Optimization of fabrication processes is essential for achieving desired performance characteristics.

Purpose of the Study:

  • To experimentally investigate and optimize three micro-fabrication techniques for W-band planar beam-wave interaction structures.
  • To compare the efficacy of micro-electric discharge milling (EDM), wire-EDM, and micro-milling for fabricating these structures.
  • To determine the optimal process parameters for minimizing dimensional deviations and surface roughness.

Main Methods:

  • Development of W-band planar beam-wave interaction structures using micro-EDM, wire-EDM, and micro-milling.
  • Analysis of fabricated structures using scanning electron microscopy (SEM) and ZETA 3D optical microscopy.
  • Experimental optimization of fabrication processes to achieve target dimensional accuracy and surface finish.

Main Results:

  • Successful fabrication of W-band planar beam-wave interaction structures using the investigated methods.
  • Quantitative analysis of dimensional deviations and surface roughness for each micro-fabrication technique.
  • Identification of process parameters leading to optimized structural quality.

Conclusions:

  • The study successfully optimized micro-fabrication techniques for W-band planar beam-wave interaction structures.
  • Achieved dimensional deviations under 10 μm and surface roughness below 50 nm.
  • The findings provide a foundation for the efficient development of high-performance W-band devices.