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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Sahil Jain1,2, Vishant1, Maninder Kaur1
1(CSIR)-Central Electronics Engineering Research Institute (CEERI), Pilani 333031, India.
This study optimized micro-fabrication for W-band structures using micro-electric discharge milling (EDM) and micro-milling. The goal was to achieve precise dimensions and smooth surfaces for advanced beam-wave interaction devices.
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