Understanding the Significance of Layer Bonding in Melt Electrowriting

Area of Science:

• Additive Manufacturing
• Biomaterials Engineering
• Materials Science

Background:

• Melt electrowriting (MEW) is a high-resolution additive manufacturing technique for creating 3D scaffolds.
• The role of layer bonding in MEW scaffold mechanical integrity is poorly understood.
• Assessing layer bonding in MEW requires novel methodologies.

Purpose of the Study:

• To systematically investigate the significance of layer bonding in MEW scaffolds.
• To determine the impact of layer bonding on scaffold mechanical properties.
• To establish methods for controlling and tailoring layer bonding in MEW.

Main Methods:

• Development of a systematic framework to assess layer bonding in MEW scaffolds.
• Utilizing poly(ɛ-caprolactone) as a model material.
• Employing a heated collector to control layer bonding.
• Investigating the influence of printing parameters, scaffold design, and print path.

Main Results:

• Printing parameters, scaffold design, and print path significantly affect MEW scaffold layer bonding.
• A 5 µm increase in fiber diameter can improve layer bonding strength by 70%.
• Scaffold architecture alone does not solely determine mechanical properties.
• A heated collector effectively controls MEW scaffold layer bonding.
• Tailored layer bond strengths within scaffolds can be achieved.

Conclusions:

• Layer bonding is a critical factor influencing the mechanical properties of MEW scaffolds.
• Controlling layer bonding offers new avenues for tailoring scaffold performance.
• This research provides a framework for optimizing MEW scaffold design and fabrication.