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Electroplated Rhenium (Re) films in multilayers with noble metals exhibit enhanced superconductivity near 6 K. This advancement enables integration into standard low-temperature electronics components.

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Area of Science:

  • Materials Science
  • Condensed Matter Physics
  • Superconductivity

Background:

  • Rhenium (Re) is a refractory metal with potential superconducting properties.
  • Previous methods for preparing Re films have limitations in achieving optimal superconducting characteristics.
  • Multilayer structures offer a route to tune material properties, including superconductivity.

Purpose of the Study:

  • To investigate the superconducting properties of electroplated Re films in multilayers with noble metals (Cu, Au, Pd).
  • To determine if electroplating enhances the superconducting critical temperature (Tc) compared to other preparation methods.
  • To assess the potential for integrating these superconducting films into electronic components.

Main Methods:

  • Electrodeposition of Re films in multilayer structures with Cu, Au, and Pd.
  • Measurement of dc resistance and magnetic susceptibility to determine superconducting critical temperature (Tc).
  • Magnetic field response measurements at low temperatures to characterize superconductivity type and critical fields.
  • Radio frequency (RF) loss measurements on deposited multilayers.

Main Results:

  • Electroplated Re films in multilayers exhibited an enhanced superconducting critical temperature (Tc) of approximately 6 K.
  • Type-II superconductivity was confirmed with an upper critical field (Hc2) around 2.5 T at 1.8 K.
  • Critical current densities (Jc) exceeding 10^7 A/m^2 were measured above liquid-helium temperature.
  • Low RF losses were observed below Tc in multilayers integrated onto copper traces on circuit boards.

Conclusions:

  • Electroplating is an effective method for preparing Re-based superconducting multilayers with improved critical temperatures.
  • The demonstrated type-II superconductivity and high critical current densities make these films suitable for applications.
  • The compatibility with standard circuit board fabrication facilitates integration into diverse low-temperature electronic devices.