Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Experiment Video

Updated: Jun 9, 2025

Challenges in Rheological Characterization of Highly Concentrated Suspensions — A Case Study for Screen-printing Silver Pastes
08:42

Challenges in Rheological Characterization of Highly Concentrated Suspensions — A Case Study for Screen-printing Silver Pastes

Published on: April 10, 2017

19.9K

Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics

Arjun Wadhwa1, Mohammad Saadati1, Jaime Benavides-Guerrero1

  • 1Department of Electrical Engineering, École de Technologie Supérieure, 1100 Notre Dame Street West, Montreal, QC H3C 1K3, Canada.

Materials (Basel, Switzerland)
|October 26, 2024
PubMed
Summary

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Controlled microstructural evolution of Hydroxyapatite-Bioglass® nanocomposites via two-step sintering.

Journal of the mechanical behavior of biomedical materials·2026
Same author

Assessment of KN95 Mask Filtering Degradation and Breathing Detection: A Pilot Study.

Sensors (Basel, Switzerland)·2025
Same author

Exchange Bias in La<sub>0.67</sub>Sr<sub>0.33</sub>MnO<sub>3</sub>/YFeO<sub>3</sub> Ferromagnet/Antiferromagnet Multilayer Heterostructures.

Small (Weinheim an der Bergstrasse, Germany)·2025
Same author

Controlling the Optical and Electrical Properties of Perovskite Films and Enhancing Solar Cell Performance Using the Photonic Curing Process.

Nanomaterials (Basel, Switzerland)·2024
Same author

Enhancing the Performance of Nanocrystalline SnO<sub>2</sub> for Solar Cells through Photonic Curing Using Impedance Spectroscopy Analysis.

Nanomaterials (Basel, Switzerland)·2024
Same author

Impact of Residual Strains on the Carrier Mobility and Stability of Perovskite Films.

Nanomaterials (Basel, Switzerland)·2024
Same journal

Correction: Yang et al. Microstructural Characteristics of High-Pressure Die Casting with High Strength-Ductility Synergy Properties: A Review. <i>Materials</i> 2023, <i>16</i>, 1954.

Materials (Basel, Switzerland)·2026
Same journal

Effect of La and Ce Microalloying on the Corrosion Resistance of 0.4Sb Low-Alloy Steel in a Harsh Marine Atmospheric Environment.

Materials (Basel, Switzerland)·2026
Same journal

High-Temperature Properties of Magnesium Ammonium Phosphate Cement Modified with Gold Tailings.

Materials (Basel, Switzerland)·2026
Same journal

A Study on the Evolution of Intermetallic Phase Microstructure and High-Temperature Creep Behavior in Mg-8.0Al-1.0Nd-1.5Gd-Mn Alloys.

Materials (Basel, Switzerland)·2026
Same journal

Material-Driven Clinical Complications in Mechanical Circulatory Support: From Blood-Material Interactions to Device-Related Adverse Events.

Materials (Basel, Switzerland)·2026
Same journal

Influence of Final Irrigation on Calcium Silicate-Based Sealer Dentinal Tubular Penetration: A Systematic Review.

Materials (Basel, Switzerland)·2026
See all related articles
This summary is machine-generated.

Adding silicon particles to silver inks significantly enhances their thermal stability. This grain boundary pinning allows for stable electrical conductivity at temperatures up to 700 °C, doubling the operational limit for screen-printed silver flake inks.

Area of Science:

  • Materials Science
  • Nanotechnology
  • Metallurgy

Background:

  • Screen-printed silver flake inks are widely used but limited by thermal instability.
  • High operating temperatures cause grain growth, degrading electrical conductivity.

Purpose of the Study:

  • To investigate the effect of silicon inclusions on the grain structure and thermal stability of screen-printed silver inks.
  • To enhance the operational temperature range of silver flake inks.

Main Methods:

  • Electron backscattered diffraction (EBSD) for grain size analysis.
  • Thermal stability testing via isothermal exposures (10 min to 4 h) at temperatures from 250 °C to 900 °C.
  • Measurement of electrical conductivity and resistivity.
Keywords:
X-ray photoelectron spectroscopy (XPS)electron backscattered diffraction (EBSD)grain boundary pinninghigh-temperature devicesprinted electronicsscreen printingsilicon particlessilver flake ink

More Related Videos

Planar and Three-Dimensional Printing of Conductive Inks
10:49

Planar and Three-Dimensional Printing of Conductive Inks

Published on: December 9, 2011

37.1K
Hybrid Printing for the Fabrication of Smart Sensors
08:35

Hybrid Printing for the Fabrication of Smart Sensors

Published on: January 31, 2019

8.1K

Related Experiment Videos

Last Updated: Jun 9, 2025

Challenges in Rheological Characterization of Highly Concentrated Suspensions &#8212; A Case Study for Screen-printing Silver Pastes
08:42

Challenges in Rheological Characterization of Highly Concentrated Suspensions — A Case Study for Screen-printing Silver Pastes

Published on: April 10, 2017

19.9K
Planar and Three-Dimensional Printing of Conductive Inks
10:49

Planar and Three-Dimensional Printing of Conductive Inks

Published on: December 9, 2011

37.1K
Hybrid Printing for the Fabrication of Smart Sensors
08:35

Hybrid Printing for the Fabrication of Smart Sensors

Published on: January 31, 2019

8.1K

Main Results:

  • Silver ink with 5 wt.% silicon inclusions exhibited significantly retarded grain growth compared to pristine ink.
  • Silicon-loaded ink maintained stable electrical conductivity up to 700 °C, a substantial increase from the conventional 400 °C limit.
  • The activation energy was reduced by 54% due to Zener pinning by silicon particles, inhibiting grain growth.

Conclusions:

  • Controlled addition of silicon particles to silver inks enables grain structure engineering for enhanced thermal stability.
  • This approach significantly expands the potential applications of screen-printed metallic inks in high-temperature environments.
  • The Zener pinning mechanism effectively stabilizes electrical properties at elevated temperatures.