An analytical heat transfer model for transient Raman thermometry analysis.

Area of Science:

• Materials Science
• Thermal Physics
• Nanotechnology

Background:

• Transient Raman thermometry offers advantages over steady-state methods by avoiding calibration and absorption measurements.
• Traditional analysis relies on time-consuming finite element methods (FEM) for heat transfer modeling.
• FEM analysis can hinder physical understanding and high-throughput experimentation.

Purpose of the Study:

• To develop a faster, more insightful analytical method for transient Raman thermometry data analysis.
• To replace computationally intensive numerical methods with a rapid analytical heat transfer model.
• To enable efficient sensitivity and uncertainty analysis for improved experimental design.

Main Methods:

• Developed a 3D analytical heat transfer model for transient Raman thermometry data fitting.
• Replaced finite element method (FEM) with analytical model for data interpretation.
• Performed quantitative sensitivity analysis based on the analytical model.

Main Results:

• Successfully measured in-plane thermal conductivity of bulk layered materials.
• Determined interfacial thermal conductance between 2D materials and quartz.
• Identified key parameters influencing sensitivity for thermal conductivity and interfacial conductance measurements.

Conclusions:

• The analytical model significantly reduces data analysis time from hours to seconds.
• The model provides new physical insights into heat transfer mechanisms in layered and 2D materials.
• This approach facilitates high-throughput measurements, experimental design, and physical interpretation.