Analysis of the Ni-5%at.W Alloy Substrate Texture Evolution at Different Strain Levels Using the EBSD Technique

Area of Science:

• Materials Science
• Metallurgy

Background:

• Understanding texture evolution in nickel-tungsten (Ni-W) alloys is crucial for optimizing their mechanical properties.
• Previous studies have explored texture development, but the specific influence of varying strain levels on cubic texture formation in Ni-5%W alloys requires further investigation.

Purpose of the Study:

• To investigate the texture evolution of Ni-5%W alloy basebands subjected to different strain variables (εvM = 3.9, 4.9, and 5.1) during rolling and annealing.
• To elucidate the relationship between strain level, nucleation rates, growth kinetics, and the resulting grain structure of the cubic texture.

Main Methods:

• Utilized electron back scattering diffraction (EBSD) to analyze the crystallographic texture of Ni-5%W alloy substrates.
• Annealed samples at high temperatures (1150 °C) after applying controlled rolling strains.

Main Results:

• All strain levels (3.9, 4.9, 5.1) achieved a strong cubic texture (>99% content) after annealing.
• Strain level significantly influenced the texture evolution trajectory and annealing temperatures.
• Lower strains (3.9, 4.9) resulted in cubic nuclei growing within a layered structure, leading to larger grains and lower nucleation rates.
• Higher strain (5.1) promoted cubic nuclei formation from equiaxed grains, increasing nucleation rates but yielding smaller grains that outcompeted random orientations.

Conclusions:

• The strain level is a critical factor controlling the nucleation and growth kinetics of cubic textures in Ni-5%W alloys.
• A strain level of 5.1 facilitates higher nucleation and growth rates for recrystallized cubic grains, leading to a more refined microstructure compared to lower strain levels.
• Optimizing strain variables is essential for tailoring the final texture and microstructure of Ni-5%W alloys for specific applications.