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Design of a Novel SiP Integrated RF Front-End Module Based on SOI Switch and SAW Filter
Xuanhe Wei1, Youming Miao1, Xiao Jin1
1College of Electrical and Electronic Engineering, Wenzhou University, Wenzhou 325035, China.
Abstract:
This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands for miniaturization and multi-functionality for application in emerging wireless technologies. The proposed architecture not only reduces the integration complexity but also considers the architectural design of the integrated module, impedance matching techniques, and signal integrity for carrier aggregation (CA) technology realization. The feasibility of employing SOI switches and SAW filters based on SiP design has been validated through the trial production of a Sub-3GHz radio frequency (RF) front-end diversity receiver module. The resulting RF front-end module demonstrates exceptionally high packaging density and enhanced communication reliability, rendering it suitable for diverse applications in miniaturized RF systems.
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