All-Polymer Composite Film with Outstanding Mechanical, Thermal Conductive, and EMI Shielding Performances

Robust polymer-based composites with high thermal conductivity (TC) and electromagnetic interference shielding effectiveness (EMI SE) hold great promise for applications in rapidly developing electronics. Traditional composites containing inorganic fillers often suffer from increases in processing difficulty, density, and significant deterioration in mechanical properties. Herein, we report for the first time a flexible multilayered all-polymer composite of poly(p-phenyl-2,6-phenylene bisoxazole) (PBO) and poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS), featuring excellent mechanical strength of 203.9 MPa, in-plane TC of 21.9 W/mK, EMI shielding effectiveness (SE) of 44.2 dB, high-temperature stability, and flame retardancy. The excellent TC, mechanical strength, and flame retardancy of PBO, the remarkable EMI shielding performance of PEDOT:PSS, and the π-π stacking interactions between adjacent layers contribute to the comprehensive properties, which outperform most of the traditional composites of polymers and inorganic fillers reported so far. This full-polymer design may pioneer a new strategy for the preparation of robust and lightweight multifunctional composites.