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Correlative Microscopy for 3D Structural Analysis of Dynamic Interactions
Published on: June 24, 2013
Daniel Torres1, Miguel Bernal1, Jon Ustarroz1,2
1ChemSIN - Chemistry of Surfaces, Interfaces and Nanomaterials, Université libre de Bruxelles (ULB), Campus de la Plaine, Boulevard du Triomphe 2, CP 255, Brussels, 1050, Belgium.
This study uses Scanning Electrochemical Cell Microscopy (SECCM) and Field Emission Scanning Electron Microscopy (FESEM) to understand copper nanoparticle growth. It links electrochemical signals to physical characteristics, improving electrochemical manufacturing.
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