Development of blue-light GaN based micro light-emitting diodes using ion implantation technology
Yu-Hsuan Hsu1,2, Shao-Hua Lin1, Dong-Sing Wuu3
1Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan, ROC.
Discover Nano
|December 17, 2024
Summary
Ion implantation, using As or Ar, improved blue micro-LED performance by reducing sidewall defects compared to dry etching. Argon implantation yielded the best results, enhancing efficiency and external quantum efficiency.
Area of Science:
- Materials Science
- Optoelectronics
- Semiconductor Physics
Background:
- Micro-LEDs (μLEDs) are crucial for advanced displays.
- Mesa fabrication is key to μLED performance.
- Dry etching can introduce sidewall defects, impacting device efficiency.
Purpose of the Study:
- To investigate ion implantation as an alternative to dry etching for μLED mesa fabrication.
- To analyze the impact of different ion species (As, Ar) on μLED performance.
- To demonstrate defect reduction strategies for small chip size devices.
Main Methods:
- Fabrication of 10 μm chip size blue GaN-based μLEDs.
- Mesa isolation using dry etching and ion implantation (As, Ar).
- Electrical and optical characterization of fabricated μLEDs.
Main Results:
- Ion-implanted μLEDs showed superior turn-on characteristics and lower leakage current than dry-etched devices.
- Argon-implanted μLEDs exhibited reduced dynamic (Rd) and series resistance (Rs).
- Wall-plug efficiency reached 10.66% and external quantum efficiency (EQE) improved significantly with implantation, especially Ar ions.
Conclusions:
- Reducing mesa sidewall defects via ion implantation enhances μLED properties by suppressing non-radiative recombination.
- Replacing dry etching with ion implantation can decrease the ideality factor and boost EQE in small μLEDs.
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