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Related Experiment Video

Updated: Jun 4, 2025

Planar and Three-Dimensional Printing of Conductive Inks
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Planar and Three-Dimensional Printing of Conductive Inks

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Microgel-Guided MXene Assembly for High-Performance, Low-Solid Content Conductive Inks.

Farivash Gholamirad1, Monirosadat Sadati1, Nader Taheri-Qazvini1,2

  • 1Department of Chemical Engineering, University of South Carolina, Columbia, South Carolina 29208, United States.

ACS Applied Materials & Interfaces
|January 2, 2025
PubMed
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Researchers developed a novel, ultralight MXene ink using microgels, enabling scalable 3D printing of advanced electromagnetic interference (EMI) shielding materials with high performance at minimal solid content.

Area of Science:

  • Materials Science
  • Nanotechnology
  • Additive Manufacturing

Background:

  • Smart device evolution demands high-performance, lightweight electromagnetic interference (EMI) shielding materials.
  • Traditional 3D-printable MXene inks require high solid content, hindering scalability and cost-efficiency.

Purpose of the Study:

  • To develop an ultralow solid content MXene-based ink for 3D printing.
  • To achieve efficient EMI shielding with enhanced mechanical properties at low density.

Main Methods:

  • Formulation of an MXene ink with 0.1 vol% solid content using cross-linked poly(acrylic acid) Carbopol microgels.
  • Utilizing microgels to create a jammed network for MXene assembly at minimal concentrations.
  • 3D printing of complex structures and coatings followed by freeze-drying.
Keywords:
3D printingCarbopolEMI shieldingTi3C2Tx MXenejammingpercolationrheology

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Last Updated: Jun 4, 2025

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Main Results:

  • Achieved the lowest reported solid content for MXene inks (0.1 vol%) with superior rheological properties.
  • Printed MXene aerogels exhibited excellent electrical conductivity (360 S/m) and EMI shielding (57 dB) at ultralow density (25 mg/cm³).
  • Demonstrated a high compression modulus (1750 kPa) for the printed aerogels.

Conclusions:

  • The MXene/microgel hybrid ink enables scalable 3D printing of lightweight, high-performance EMI shielding materials.
  • This approach overcomes limitations of traditional MXene inks, offering transformative potential for diverse applications.
  • Detailed structure-processing-performance analysis provides a roadmap for future material development.