Related Experiment Video
Updated: Jul 13, 2026

Fabrication and Testing of Photonic Thermometers
Published on: October 24, 2018
Bioinspired thermally conducting packaging for heat management of high performance electronic chips
Huawei Wang1, Pengfei Bai2, He Cui1
1Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, PR China.
Abstract:
Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Here we propose and fabricate a closed high-conducting heat chip package based on passive phase change, using silicon carbide which is physically and structurally compatible with chip die materials. Our "chip on vapor chamber" (CoVC) concept realizes rapid diffusion of hot spots, and eliminates the high energy consumption of refrigeration ordinarily required for heat management. Multi-scale wicks and bionic vein structures are applied to CoVC leading to an increase of 164% in heat transfer performance. The thermal resistance of the package was only a third that of traditional packaging systems. This means that the structure of CoVC has a good thermal conducting ability and can reduce energy consumption for heat dissipation.
More Related Videos
Related Concept Videos
Mechanism of heat transfer
Thermal Stress
Mechanisms of Heat Transfer I
Mechanisms of Heat Transfer II
Mechanisms of Heat Transfer
Conduction, accounting for approximately 3% of body heat loss at rest, is the process of exchanging heat between molecules of two materials in direct contact. This can result in both heat loss and gain. For instance, when the body is submerged in water, which conducts heat 20 times more effectively than air, it can either lose or gain significant heat.

