Pengfei Bai
2PUBLICATIONS
3CO-AUTHORS
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Publications (2)
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|Jan 04, 2025
Bioinspired thermally conducting packaging for heat management of high performance electronic chips.Huawei Wang, Pengfei Bai, He Cui
|Dec 05, 2024
Adjusting Interface Action and Spacing for Control of Particle Potential.Mian Qin, Jiangsong Ren, Jiamin Cheng
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