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Updated: May 7, 2025

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
Published on: March 20, 2019
Effect of electrodeposition time on physical characteristics and antibacterial activity of copper-incorporated TiO2
Justynne Fabian1, Grant Morton2, Shubham Sharma1
1Centre for Research in Engineering Surface Technology (CREST), Technological University Dublin City Campus, Kevin Street Dublin 8 Ireland justynnefabian@gmail.com swarren747@gmail.com.
Abstract:
The current work outlines the preparation of a TiO2 nanotube (NT) layer electrochemically formed on the surface of a clinically-relevant titanium alloy via anodisation. This NT layer was subsequently modified via alternating current electrodeposition to incorporate copper micro- and nanoparticles on top of and within the NTs. Physical characterisation of the NT layer and the copper-incorporated NTs was carried out through analysis of the surface morphology, elemental composition, crystallinity, and stability via SEM, EDX, XRD, and ICP-OES, respectively. After immersion in Dulbecco's phosphate buffer saline solution at 37 °C for 24 hours, the electrodeposited copper particles transformed into Cu3(PO4)2·3H2O microflowers. Bacterial susceptibility tests were carried out against E. coli and S. aureus. The antibacterial activity was influenced by the physical characteristics of the electrodeposited copper, the transformation of the copper particles to microflowers, and the extent at which the copper-incorporated surface released Cu2+ ions.

