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Series-Fed Microstrip Patch Antenna Array with Additive-Manufactured Foldable Honeycomb-Shaped Substrate.

Sima Noghanian1, Yi-Hsiang Chang2, Patricio Guerron3

  • 1CommScope Ruckus Networks, Sunnyvale, CA 94089, USA.

Micromachines
|January 8, 2025
PubMed
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This study introduces a new foldable S-band microstrip patch antenna array. Its innovative hinge design allows reconfiguration, achieving a gain of 7.72 dBi for versatile wireless applications.

Area of Science:

  • Electrical Engineering
  • Electromagnetics
  • Antenna Theory

Background:

  • Microstrip patch antennas are widely used due to their low profile and ease of integration.
  • Reconfigurable antennas offer flexibility in wireless communication systems.
  • Additive manufacturing provides novel fabrication possibilities for complex antenna structures.

Purpose of the Study:

  • To present a novel foldable S-band microstrip patch antenna array.
  • To demonstrate a reconfigurable antenna design using additive manufacturing.
  • To address the challenge of feeding elements in a foldable antenna array.

Main Methods:

  • Design and simulation of a foldable S-band microstrip patch antenna array.
  • Utilizing additive manufacturing for substrate fabrication.
Keywords:
3D-printed antennafoldable antennahingemicrostrip antenna

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  • Development of a novel hinge mechanism for array reconfiguration and coaxial cable feeding.
  • Main Results:

    • Fabrication and measurement of a 2x1 microstrip array unit as proof of concept.
    • Experimental results closely match simulation predictions.
    • Achieved a maximum gain of 7.72 dBi in flat configuration.

    Conclusions:

    • The proposed foldable antenna array design is feasible and effective.
    • The novel hinge design successfully facilitates reconfiguration and maintains performance.
    • This technology offers potential for versatile and reconfigurable antenna solutions.