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Series-Fed Microstrip Patch Antenna Array with Additive-Manufactured Foldable Honeycomb-Shaped Substrate.

Sima Noghanian¹, Yi-Hsiang Chang², Patricio Guerron³

¹CommScope Ruckus Networks, Sunnyvale, CA 94089, USA.

|January 8, 2025

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This study introduces a new foldable S-band microstrip patch antenna array. Its innovative hinge design allows reconfiguration, achieving a gain of 7.72 dBi for versatile wireless applications.

Area of Science:

Electrical Engineering
Electromagnetics
Antenna Theory

Background:

Microstrip patch antennas are widely used due to their low profile and ease of integration.
Reconfigurable antennas offer flexibility in wireless communication systems.
Additive manufacturing provides novel fabrication possibilities for complex antenna structures.

Purpose of the Study:

To present a novel foldable S-band microstrip patch antenna array.
To demonstrate a reconfigurable antenna design using additive manufacturing.
To address the challenge of feeding elements in a foldable antenna array.

Main Methods:

Design and simulation of a foldable S-band microstrip patch antenna array.
Utilizing additive manufacturing for substrate fabrication.

Keywords:

3D-printed antenna foldable antenna hinge microstrip antenna

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Development of a novel hinge mechanism for array reconfiguration and coaxial cable feeding.

Main Results:

Fabrication and measurement of a 2x1 microstrip array unit as proof of concept.
Experimental results closely match simulation predictions.
Achieved a maximum gain of 7.72 dBi in flat configuration.

Conclusions:

The proposed foldable antenna array design is feasible and effective.
The novel hinge design successfully facilitates reconfiguration and maintains performance.
This technology offers potential for versatile and reconfigurable antenna solutions.